Invention Grant
- Patent Title: Interface circuit and packet transmission method thereof
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Application No.: US16216071Application Date: 2018-12-11
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Publication No.: US10719472B2Publication Date: 2020-07-21
- Inventor: Eunji Lee , Junghyo Woo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey and Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3204122c
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42 ; G06F12/0866

Abstract:
A packet transmission method includes packaging a plurality of data in the form of a payload; storing information on whether the plurality of data are packaged in a header, the payload or a CRC area including a transmission error check code of the plurality of data; combining the header, the payload, and the CRC area with each other to generate a transaction layer packet; and outputting a packet including the transaction layer packet.
Public/Granted literature
- US20190108156A1 INTERFACE CIRCUIT AND PACKET TRANSMISSION METHOD THEREOF Public/Granted day:2019-04-11
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