Disclosed is an electronic document, a body of which includes an inlay, a part of which forms a spotface of a cavity, and which includes a connection land formed on the part forming the spotface, and a module of which includes an electrical circuit that includes both a first subcircuit configured to electrically connect a port of a chip to the connection land and a second subcircuit configured to electrically connect the connection land to an external electrical contact land of a carrier of the module.