Invention Grant
- Patent Title: Method for manufacturing a conductive wire
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Application No.: US15723643Application Date: 2017-10-03
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Publication No.: US10720258B2Publication Date: 2020-07-21
- Inventor: Seigi Aoyama , Toru Sumi , Takashi Hayasaka , Ryohei Okada , Detian Huang , Tamotsu Sakurai , Satoshi Yajima , Minoru Takatsuto , Hiroshi Bando
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Roberts Calderon Safran & Cole P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@162ca1b6
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C22F1/08 ; B22D11/00 ; H01B11/18 ; H01B13/016

Abstract:
A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
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