Invention Grant
- Patent Title: Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components
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Application No.: US16018813Application Date: 2018-06-26
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Publication No.: US10720340B2Publication Date: 2020-07-21
- Inventor: Michel Hendrikus Lambertus Teunissen
- Applicant: Besi Netherlands B.V.
- Applicant Address: NL Duiven
- Assignee: Besi Netherlands B.V.
- Current Assignee: Besi Netherlands B.V.
- Current Assignee Address: NL Duiven
- Agency: The Webb Law Firm
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@64a213b1
- Main IPC: H01L21/56
- IPC: H01L21/56 ; B29C45/14 ; B29C45/37 ; H01L21/78 ; H01L23/31
Abstract:
The invention relates to a mould for encapsulating electronic components mounted on a carrier, with at least two mould parts which are displaceable relative to each other for engaging with a mould cavity round electronic components, and at least one feed for encapsulating material recessed into the mould parts and connecting to the mould cavity. The invention also relates to a carrier with encapsulated electronic components. The invention further relates to a method for encapsulating electronic components and to the thus manufactured encapsulated separated components.
Public/Granted literature
Information query
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