- Patent Title: Substrate processing apparatus and method of transferring substrate
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Application No.: US15708351Application Date: 2017-09-19
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Publication No.: US10720356B2Publication Date: 2020-07-21
- Inventor: Keiichi Nagakubo , Yoshiaki Sasaki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@44412488
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; H01L21/677 ; H01L21/68

Abstract:
There is provided a substrate processing apparatus having a transfer arm configured to transfer two substrates between a transfer chamber and a processing chamber having two mounting tables, the transfer arm holding the two substrates in a state where the two substrates overlap each other with a gap between the two substrates. The substrate processing apparatus includes: a lower substrate detection sensor configured to detect an edge portion of a lower substrate when the lower substrate is transferred; and an upper substrate detection sensor configured to detect an edge portion of an upper substrate when the upper substrate is transferred.
Public/Granted literature
- US20180082881A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF TRANSFERRING SUBSTRATE Public/Granted day:2018-03-22
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