Invention Grant
- Patent Title: Electronic component mounting board and electronic device
-
Application No.: US15760976Application Date: 2016-11-09
-
Publication No.: US10720394B2Publication Date: 2020-07-21
- Inventor: Takuji Okamura , Akihiko Funahashi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@672d2f6
- International Application: PCT/JP2016/083266 WO 20161109
- International Announcement: WO2017/086222 WO 20170526
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L33/62 ; H01L23/13 ; H01L21/48 ; H01L23/053 ; H01L23/498 ; H04N5/225 ; H01L23/552 ; H01L27/146 ; H01L33/48
Abstract:
An electronic component mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an electronic component mounting portion in a central area of an upper surface of the inorganic substrate in which an electronic component is mountable. The wiring board is a frame surrounding the electronic component mounting portion on the upper surface of the inorganic substrate. The bond is located between the inorganic substrate and the wiring board. The inorganic substrate includes a downward bend outward from a bond area including the bond.
Public/Granted literature
- US20180254251A1 ELECTRONIC COMPONENT MOUNTING BOARD AND ELECTRONIC DEVICE Public/Granted day:2018-09-06
Information query
IPC分类:
