Invention Grant
- Patent Title: Integrated fan-out package structures with recesses in molding compound
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Application No.: US16101902Application Date: 2018-08-13
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Publication No.: US10720403B2Publication Date: 2020-07-21
- Inventor: Po-Hao Tsai , Li-Hui Cheng , Jui-Pin Hung , Jing-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/538 ; H01L21/683 ; H01L21/3105 ; H01L21/311 ; H01L21/78 ; H01L23/31
Abstract:
A package includes a first die and a second die. The first die includes a first substrate and a first metal pad overlying the first substrate. The second die includes a second substrate and a second metal pad overlying the second substrate. A molding compound molds the first die and the second die therein. The molding compound has a first portion between the first die and the second die, and a second portion, which may form a ring encircles the first portion. The first portion and the second portion are on opposite sides of the first die. The first portion has a first top surface. The second portion has a second top surface higher than the first top surface.
Public/Granted literature
- US20180350770A1 Integrated Fan-Out Package Structures with Recesses in Molding Compound Public/Granted day:2018-12-06
Information query
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