Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US16103704Application Date: 2018-08-14
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Publication No.: US10720503B2Publication Date: 2020-07-21
- Inventor: Kuo-Cheng Ching , Shi-Ning Ju , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/8234 ; H01L27/088 ; H01L29/78 ; H01L29/06

Abstract:
A semiconductor device includes a semiconductor substrate, a first fin structure and a second fin structure. The first fin structure includes a first fin and at least two first nano wires disposed above the first fin, and the first fin protrudes from the semiconductor substrate. The second fin structure includes a second fin and at least two second nano wires disposed above the second fin, and the second fin protrudes from the semiconductor substrate. Each first nano wire has a first width different from a second width of each second nano wire.
Public/Granted literature
- US20200058556A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-02-20
Information query
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