Invention Grant
- Patent Title: Pressure sensor and pressure sensor module
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Application No.: US15538374Application Date: 2015-10-29
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Publication No.: US10720534B2Publication Date: 2020-07-21
- Inventor: Michikazu Tomita
- Applicant: Fujikura Ltd.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3df8da9c
- International Application: PCT/JP2015/080542 WO 20151029
- International Announcement: WO2016/103907 WO 20160630
- Main IPC: H01L29/84
- IPC: H01L29/84 ; G01L9/00 ; G01L19/06 ; G01L19/00

Abstract:
A pressure sensor includes a base including an accommodation portion, a pressure sensor element disposed in the accommodation portion, and a lead portion electrically-connected to the pressure sensor element, including a terminal portion provided along a lower surface of the base, and being exposed to an outside of the base, where the terminal portion includes a recessed groove portion provided on a second surface which is an opposite surface of a first surface facing the body, and where the recessed groove portion divides at the second surface, a first region including a tip of the terminal portion and a second region next to the first region and away from the tip of the terminal portion.
Public/Granted literature
- US20170345949A1 PRESSURE SENSOR AND PRESSURE SENSOR MODULE Public/Granted day:2017-11-30
Information query
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