Invention Grant
- Patent Title: Emitter array with shared via to an ohmic metal shared between adjacent emitters
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Application No.: US16363753Application Date: 2019-03-25
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Publication No.: US10720758B2Publication Date: 2020-07-21
- Inventor: Albert Yuen , Ajit Vijay Barve
- Applicant: Lumentum Operations LLC
- Applicant Address: US CA Milpitas
- Assignee: Lumentum Operations LLC
- Current Assignee: Lumentum Operations LLC
- Current Assignee Address: US CA Milpitas
- Agency: Harrity & Harrity, LLP
- Main IPC: H01S5/42
- IPC: H01S5/42 ; H01S5/042 ; H01S5/028 ; H01S5/183 ; H01S5/343
Abstract:
An emitter array may comprise a plurality of emitters that includes two adjacent emitters. The ohmic metal layer may include a portion that is shared by, and located between, the two adjacent emitters. The emitter array may comprise a protective layer over the ohmic metal layer. The emitter array may comprise a via through the protective layer to the portion. The via is shared by, and located between, the two adjacent emitters.
Public/Granted literature
- US20190305522A1 EMITTER ARRAY WITH SHARED VIA TO AN OHMIC METAL SHARED BETWEEN ADJACENT EMITTERS Public/Granted day:2019-10-03
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