Invention Grant
- Patent Title: Piezoelectric package-integrated acoustic transducer devices
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Application No.: US16096568Application Date: 2016-07-01
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Publication No.: US10721568B2Publication Date: 2020-07-21
- Inventor: Georgios C. Dogiamis , Feras Eid , Adel A. Elsherbini , Johanna Swan , Shawna M. Liff , Thomas L. Sounart , Sasha N. Oster
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/040843 WO 20160701
- International Announcement: WO2018/004688 WO 20180104
- Main IPC: H04R17/00
- IPC: H04R17/00 ; B06B1/06

Abstract:
Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.
Public/Granted literature
- US20190141456A1 PIEZOELECTRIC PACKAGE-INTEGRATED ACOUSTIC TRANSDUCER DEVICES Public/Granted day:2019-05-09
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