Invention Grant
- Patent Title: Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
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Application No.: US15737498Application Date: 2016-07-04
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Publication No.: US10721817B2Publication Date: 2020-07-21
- Inventor: Yoichi Takano , Nobuyoshi Ohnishi , Hiroshi Takahashi , Eisuke Shiga
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f17c130
- International Application: PCT/JP2016/069737 WO 20160704
- International Announcement: WO2017/006887 WO 20170112
- Main IPC: C08L45/00
- IPC: C08L45/00 ; H05K1/03 ; C08J5/24 ; C08F267/10 ; C08G73/00 ; C08F222/40 ; C08F34/00 ; C08G73/12 ; C08G77/26 ; C08G81/02 ; C08L39/04 ; C08L79/08 ; C08L83/08
Abstract:
The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
Public/Granted literature
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