Electronics chassis compound cylinder pressure vessel
Abstract:
Systems (100) and methods (1500) for using a pressure vessel. The methods comprise: obtaining the pressure vessel comprising a shell and an insert having an interference fit with the shell whereby the insert is locked in place within the shell via interfacial pressure; inserting at least one electronic component in a first hollow cavity formed in the insert; mechanically supporting the at least one electronic component using a structural feature of the insert; and transferring heat from the electronic component to an external environment via a heat transfer path that comprises a full surface area of the insert's outer surface abutting the shell's inner surface.
Public/Granted literature
Information query
Patent Agency Ranking
0/0