A heat dissipator structure includes a heat-dissipation base and a conductive metal block. The heat-dissipation base includes a substrate and a plurality of heat-dissipating fins disposed on the substrate. A receiving portion and a limit sliding block are disposed on the substrate, with the limit sliding block disposed on the receiving portion and movable within a restrictive interval. The conductive metal block includes a body portion, an assembling portion disposed beside the body portion, and a heat dissipation plane disposed on the body portion to face away from the assembling portion and be in contact with an electronic component, with the assembling portion disposed on the receiving portion, a positioning slot disposed on the assembling portion to hold the limit sliding block laterally and keep the heat dissipation plane flat, and at least one resilient unit disposed between the assembling portion plane and the receiving portion plane to provide resilient support to the conductive metal block.