Invention Grant
- Patent Title: Flexible thermal cooling assembly
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Application No.: US16525347Application Date: 2019-07-29
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Publication No.: US10721842B1Publication Date: 2020-07-21
- Inventor: Nabeel Fathi
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Nolte Intellectual Property Law Group
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cooling assembly for cooling a heat source includes a cold plate to absorb heat from the heat source. The cold plate defines a first groove. A thermally conductive clamp is removably secured to a liquid cooling tube. The thermally conductive clamp defines a second groove. A heat pipe includes a first end to fit within the first groove in the cold plate and a second end to fit within the second groove in the thermally conductive clamp. The heat pipe transfers heat absorbed by the cold plate to the liquid cooling tube via the thermally conductive clamp.
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