Invention Grant
- Patent Title: Cooling via a sleeve connector
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Application No.: US15565945Application Date: 2015-04-30
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Publication No.: US10721843B2Publication Date: 2020-07-21
- Inventor: Kevin Leigh , George Megason
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Dicke, Billig, Czaja, PLLC
- International Application: PCT/US2015/028522 WO 20150430
- International Announcement: WO2016/175834 WO 20161103
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14 ; H04B10/40

Abstract:
One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.
Public/Granted literature
- US20180054922A1 COOLING VIA A SLEEVE CONNECTOR Public/Granted day:2018-02-22
Information query