Invention Grant
- Patent Title: Automatic splicing device
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Application No.: US15562468Application Date: 2015-03-31
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Publication No.: US10721846B2Publication Date: 2020-07-21
- Inventor: Daisuke Nakamura , Masato Shibuya
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2015/060214 WO 20150331
- International Announcement: WO2016/157436 WO 20161006
- Main IPC: B65H5/28
- IPC: B65H5/28 ; H05K13/02 ; B65H19/18 ; H05K13/08 ; B65H20/20 ; H05K13/04

Abstract:
An automatic splicing device (20) provided with a communication device (40) configured to communicate with a component mounter (M) or a host computer (HC) that is connected to the component mounter (M) such that communication is possible, a connection control device (100 [103]) configured to control connecting of the a first tape (Tc) and a second tape (Tc), and a display device (90) configured to display information related to connecting of the first tape (Tc) and the second tape (Tc).
Public/Granted literature
- US20180098467A1 AUTOMATIC SPLICING DEVICE Public/Granted day:2018-04-05
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