Invention Grant
- Patent Title: System for performing work on substrate and insertion method
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Application No.: US15768748Application Date: 2015-10-22
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Publication No.: US10721851B2Publication Date: 2020-07-21
- Inventor: Takuya Iwata
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2015/079812 WO 20151022
- International Announcement: WO2017/068682 WO 20170427
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K13/08 ; H05K13/04 ; H05K13/00 ; G06T7/00

Abstract:
A cut and clinch device is provided with a pair of slide bodies, unit main body that holds the pair of slide bodies so as to be capable of moving towards and away from each other, and pitch changing mechanism that changes an insertion hole spacing distance that is a distance between insertion holes formed in the pair of slide bodies. Also, the leaded component held by the component holding tool is imaged by the imaging device before the leads are inserted into the through-holes of the board, and based on the imaging data, the lead spacing distance that is the distance between the pair of leads of the leaded component is calculated. Then, the pair of slide bodies are moved towards or away from each other such that the calculated lead spacing distance and the insertion hole spacing distance are the same.
Public/Granted literature
- US20180303016A1 SYSTEM FOR PERFORMING WORK ON SUBSTRATE AND INSERTION METHOD Public/Granted day:2018-10-18
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