Invention Grant
- Patent Title: Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining method
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Application No.: US14765774Application Date: 2014-01-28
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Publication No.: US10724137B2Publication Date: 2020-07-28
- Inventor: Osamu Morita , Shinichiro Mori , Kenji Kameda
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELETRIC CORPORATION
- Current Assignee: KOKUSAI ELETRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a3f6ce9
- International Application: PCT/JP2014/051750 WO 20140128
- International Announcement: WO2014/123028 WO 20140814
- Main IPC: C23C16/44
- IPC: C23C16/44 ; H01J37/32 ; C23C16/22 ; C23C16/52 ; H01L21/66 ; C23C16/24 ; C23C16/455 ; H01L21/02

Abstract:
According to one aspect of the present disclosure, there is provided a cleaning method including: cleaning a component in which a deposit adhering to the component constituting an apparatus is removed by supplying and discharging a cleaning gas, wherein the act of cleaning includes controlling the apparatus so that a signal, which indicates a concentration of a predetermined gas generated by a reaction of the deposit and the cleaning gas, reaches a predetermined upper limit value or less and then stays within a range between the predetermined upper limit value and a predetermined lower limit value for a predetermined time period.
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Information query
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