Invention Grant
- Patent Title: Heat pipe and method for making the same
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Application No.: US15397067Application Date: 2017-01-03
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Publication No.: US10724803B2Publication Date: 2020-07-28
- Inventor: Shih-Lin Huang , Chiu-Kung Chen , Ti-Jun Wang , Quan Zhang
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5028f791
- Main IPC: F28D15/04
- IPC: F28D15/04 ; H05K7/20 ; F28D15/02 ; F28D21/00
Abstract:
A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.
Public/Granted literature
- US20170343299A1 HEAT PIPE AND METHOD FOR MAKING THE SAME Public/Granted day:2017-11-30
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