Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15406024Application Date: 2017-01-13
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Publication No.: US10725489B2Publication Date: 2020-07-28
- Inventor: Hiroyuki Kikuta
- Applicant: LAPIS SEMICONDUCTOR CO., LTD.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@69fb4fb0
- Main IPC: G05F1/625
- IPC: G05F1/625 ; H03M1/12 ; H03M1/80

Abstract:
A semiconductor device including a resistance section that includes a first terminal and a second terminal disposed in contact with an outer periphery, and a serial resistance section in which plural resistance elements are connected in series, wherein one end of the serial resistance section is connected to the first terminal, and another end of the serial resistance section is connected to the second terminal; and a current adjustment section that includes a current source that supplies current to the serial resistance section, and disposed adjacent to the resistance section such that a distance between the first terminal and the current adjustment section along the outer periphery of the resistance section and a distance between the second terminal and the current adjustment section along the outer periphery of the resistance section are equal.
Public/Granted literature
- US20170131731A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-05-11
Information query
IPC分类: