Invention Grant
- Patent Title: Buffer-bay placement in an integrated circuit
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Application No.: US16157294Application Date: 2018-10-11
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Publication No.: US10726185B2Publication Date: 2020-07-28
- Inventor: Jayaprakash Udhayakumar , Sumantra Sarkar , Chaitanya Kompalli , Srinivasa Rahul Batchu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Steven Meyers
- Main IPC: G06F30/394
- IPC: G06F30/394 ; G06F30/392 ; G06F30/398 ; G06F111/04 ; G06F111/20 ; G06F119/12 ; G06F119/18

Abstract:
Aspects include performing integrated circuit design. A processor identifies a child block of an integrated circuit for placement of a buffer-bay to insert a buffer in a portion of the integrated circuit reserved for the child block. The buffer-bay is divided into a plurality of buffer-bay segments. Parent-level routing information and one or more boundary conditions are analyzed to determine a plurality of placement options for the buffer-bay segments. A best possible placement is selected from the plurality of placement options for the buffer-bay segments as a planned buffer-bay layout. A routing of the integrated circuit is performed based on the planned buffer-bay layout.
Public/Granted literature
- US20200117768A1 BUFFER-BAY PLACEMENT IN AN INTEGRATED CIRCUIT Public/Granted day:2020-04-16
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