Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US15910393Application Date: 2018-03-02
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Publication No.: US10727043B2Publication Date: 2020-07-28
- Inventor: Taiki Hinode , Sadamu Fujii
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@54e7f3ae
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/08 ; B08B3/10 ; B08B3/02 ; H01L21/67 ; H01L21/687
Abstract:
A hole is formed on a liquid film of a low surface tension liquid which covers an entire region of an upper surface of a substrate, and a central portion of the upper surface of the substrate is exposed. The hole in the liquid film of the low surface tension liquid is expanded up to an outer circumference of the substrate. Discharge of hot water is stopped before formation of the hole in the liquid film of the low surface tension liquid. After the liquid film of the low surface tension liquid has been expelled from the upper surface of the substrate, hot water is supplied again to a lower surface of the substrate. A liquid adhering to the substrate is shaken off after stoppage of discharge of the hot water.
Public/Granted literature
- US20180277356A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-09-27
Information query
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