Invention Grant
- Patent Title: Semiconductor apparatus
-
Application No.: US15939376Application Date: 2018-03-29
-
Publication No.: US10727152B2Publication Date: 2020-07-28
- Inventor: Hiroki Tanaka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@47b412ed
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/367 ; H01L23/24 ; H01L23/29 ; H01L23/00 ; H01L23/08 ; H01L23/053 ; H01L23/04 ; H01L23/373 ; H01L25/065 ; H01L23/498
Abstract:
A semiconductor apparatus includes: a radiator plate; a resin insulating layer provided on the radiator plate; a resin block made of resin and armularly disposed to cover an end part of the radiator plate and an end part of the resin insulating layer; a case disposed to cover the resin block; and a sealing material filled in an inside of the case.
Public/Granted literature
- US20190103334A1 SEMICONDUCTOR APPARATUS Public/Granted day:2019-04-04
Information query
IPC分类:
