There is provided a semiconductor package including a mounting frame having a conductive chip mounting region, a first semiconductor chip mounted on the chip mounting region and including a first semiconductor element, a second semiconductor chip mounted on the chip mounting region and including a second semiconductor element, and a conductive clip of a plate shape. The conductive clip includes a first component disposed above the mounting frame with the first semiconductor chip interposed therebetween, and a second component separated from the first component and disposed above the mounting frame with the second semiconductor chip interposed therebetween. The second main electrode of the first semiconductor element and the first main electrode of the second semiconductor element are short-circuited by the chip mounting region, so that the first semiconductor element and the second semiconductor element are cascade-connected.