Various embodiments may provide a method of forming a semiconductor packaging structure. The method may include forming a plurality of semiconductor packages, each semiconductor package including a semiconductor die and a mold encapsulation structure. The method may also include arranging the plurality of semiconductor packages to form a vertical stacked arrangement with a mold portion including a plurality of mold encapsulation structures, the mold portion extending from a first side to a second side of the vertical stacked arrangement opposite the first side. The method may additionally include forming a first via on the mold portion at the first side of the vertical stacked arrangement, forming a second via on the mold portion at the second side of the vertical stacked arrangement, and forming an electrically conductive filled via extending through the mold portion from the first side to the second side of the vertical stacked arrangement.