Invention Grant
- Patent Title: Semiconductor apparatus
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Application No.: US16233830Application Date: 2018-12-27
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Publication No.: US10727306B2Publication Date: 2020-07-28
- Inventor: Sho Tanaka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2cfe289e
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/40 ; H01L29/739

Abstract:
A semiconductor apparatus includes a semiconductor substrate. Semiconductor substrate includes an active region and a peripheral region surrounding active region. Semiconductor substrate has a front surface and a back surface. A semiconductor device includes an n− drift region and a p+ collector layer. Peripheral region includes n− drift region and a p+ back surface peripheral layer. P+ back surface peripheral layer is provided on the back surface side of n− drift region. A first hole concentration in p+ back surface peripheral layer is higher than a second hole concentration in p+ collector layer. The short-circuit capability of semiconductor apparatus is improved.
Public/Granted literature
- US20190333999A1 SEMICONDUCTOR APPARATUS Public/Granted day:2019-10-31
Information query
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