Invention Grant
- Patent Title: Contact formation on germanium-containing substrates using hydrogenated silicon
-
Application No.: US16057324Application Date: 2018-08-07
-
Publication No.: US10727310B2Publication Date: 2020-07-28
- Inventor: Karthik Balakrishnan , Pouya Hashemi , Bahman Hekmatshoartabari , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/40 ; H01L29/16 ; H01L29/24 ; H01L21/30 ; H01L21/02 ; H01L21/28 ; H01L21/3065 ; H01L29/417 ; H01L29/66 ; H01L21/285 ; H01L21/768 ; H01L23/485

Abstract:
A method and structure is provided in which germanium or a germanium tin alloy can be used as a channel material in either planar or non-planar architectures, with a functional gate structure formed utilizing either a gate first or gate last process. After formation of the functional gate structure, and contact openings within a middle-of-the-line (MOL) dielectric material, a hydrogenated silicon layer is formed that includes hydrogenated crystalline silicon regions disposed over the germanium or a germanium tin alloy, and hydrogenated amorphous silicon regions disposed over dielectric material. The hydrogenated amorphous silicon regions can be removed selective to the hydrogenated crystalline silicon regions, and thereafter a contact structure is formed on the hydrogenated crystalline silicon regions.
Public/Granted literature
- US20180350936A1 CONTACT FORMATION ON GERMANIUM-CONTAINING SUBSTRATES USING HYDROGENATED SILICON Public/Granted day:2018-12-06
Information query
IPC分类: