Invention Grant
- Patent Title: Light emitting device
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Application No.: US16457594Application Date: 2019-06-28
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Publication No.: US10727375B2Publication Date: 2020-07-28
- Inventor: Motokazu Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e402684
- Main IPC: H01L33/44
- IPC: H01L33/44 ; H01L33/62 ; H01L25/075 ; H05K1/18 ; H05K3/00 ; F21V21/08 ; F21S4/24 ; H01L33/08 ; H01L33/56 ; F21Y103/10 ; F21Y115/10 ; H01L33/54 ; F21Y101/00

Abstract:
A light emitting device includes a flexible substrate, at least one light emitting element, and a cover member. The flexible substrate has a first surface and a second surface, and includes a flexible base member and wiring portions disposed on a first surface side. The cover member is arranged on the second surface of the flexible substrate and defines at least a part of a recess defining an air layer. The recess is positioned so that a total maximum thickness of the flexible substrate and the cover member in a region corresponding to a region on the first surface where the at least one light emitting element is arranged is smaller than a total maximum thickness of the flexible substrate and the cover member in a region other than the region corresponding to the region on the first surface where the at least one light emitting element is arranged.
Public/Granted literature
- US20190326479A1 LIGHT EMITTING DEVICE Public/Granted day:2019-10-24
Information query
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