Invention Grant
- Patent Title: Switch assembly of reactive power compensation apparatus
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Application No.: US16279521Application Date: 2019-02-19
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Publication No.: US10727652B2Publication Date: 2020-07-28
- Inventor: Teagsun Jung
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@55e61b33
- Main IPC: H02B1/04
- IPC: H02B1/04 ; H02B1/56 ; H05K7/20 ; H01L23/473 ; H02J3/18 ; H02M7/00 ; H01L23/40 ; H01L25/11

Abstract:
A switch assembly of a reactive power compensation apparatus may include a first switching module having a first stack structure perpendicular to a supporting module, a second switching module having a second stack structure perpendicular to the supporting module, the second switching module being connected in parallel with the first switching module, and first and second supporting members disposed above and below the first and second switching modules.
Public/Granted literature
- US20190305525A1 SWITCH ASSEMBLY OF REACTIVE POWER COMPENSATION APPARATUS Public/Granted day:2019-10-03
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