A printed circuit board (1) comprises a conductive outer layer (2) and at least one conductive inner layer (4, 14). At least one bus bar (7, 8) for conducting high current and at least one power semiconductor (12) for controlling and/or activating the high current are disposed on a side of the outer layer (2) facing away from the at least one inner layer (4, 14). The printed circuit board (1) allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board (1) can be produced economically and flexibly.