- Patent Title: Minimally invasive interspinous process spacer implants and methods
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Application No.: US15935734Application Date: 2018-03-26
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Publication No.: US10729476B2Publication Date: 2020-08-04
- Inventor: Daniel Thommen , Markus Weber , Jacques Teisen , Markus Kraft , Florian Kaufmann , Markus Hunziker , Felix Aschmann , Stefan Saladin , Martin Oswald , Roman Randegger
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: Meunier Carlin & Curfman LLC
- Main IPC: A61B17/70
- IPC: A61B17/70 ; A61B17/00 ; A61B90/00

Abstract:
An interspinous process spacer for implantation in an interspinous space between a superior spinous process and an inferior spinous process includes a balloon-like body, a first deployable protrusion and a second deployable protrusion. The body has a distal end, a proximal end and a longitudinal axis extending between the proximal and distal ends. The spacer is arrangeable in an unexpanded configuration and an expanded configuration. The first deployable protrusion is mounted proximate the proximal end and the second deployable protrusion is mounted proximate the distal end. The first and second deployable protrusions are oriented generally parallel to the longitudinal axis in the unexpanded configuration and generally perpendicular to the longitudinal axis in the expanded configuration.
Public/Granted literature
- US20180344363A1 MINIMALLY INVASIVE INTERSPINOUS PROCESS SPACER IMPLANTS AND METHODS Public/Granted day:2018-12-06
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