Invention Grant
- Patent Title: Additive manufacturing system for minimizing thermal stresses
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Application No.: US16733913Application Date: 2020-01-03
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Publication No.: US10730110B2Publication Date: 2020-08-04
- Inventor: Sergey Mironets , Alexander Staroselsky
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P.A.
- Main IPC: B29C64/20
- IPC: B29C64/20 ; B29C64/205 ; B22F3/105 ; B22F3/00 ; B33Y10/00 ; B33Y30/00 ; B33Y40/00

Abstract:
A build plate for an additive manufacturing system is disclosed. The build plate includes a support structure, a sub-plate, and one or more transducers. The support structure is configured to support a stack of sintered layers of a pulverant material. Further, the support structure extends orthogonally to a build direction. The sub-plate is arranged along the support structure, and defines a transducer cavity. One or more transducers are arranged in the transducer cavities. The one or more transducers are operable to cause vibration of the support structure and the stack parallel to the build direction. Such vibration relieves internal stresses caused by sintering of the stack.
Public/Granted literature
- US20200139437A1 ADDITIVE MANUFACTURING SYSTEM FOR MINIMIZING THERMAL STRESSES Public/Granted day:2020-05-07
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