Invention Grant
- Patent Title: Die assembly for producing a film
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Application No.: US15639106Application Date: 2017-06-30
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Publication No.: US10730222B2Publication Date: 2020-08-04
- Inventor: Wenyi Huang , Jeffrey D. Wenzel , Jie Feng , Robert E. Wrisley , Hyunwoo Kim , Kurt A. Koppi , Scott R. Kaleyta , Thomas J. Parsons , Nicolas Cardoso Mazzola , Harpreet Singh
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Quarles & Brady LLP
- Main IPC: B32B27/30
- IPC: B32B27/30 ; B29C48/30 ; B29C48/305 ; B29C48/07 ; B29C48/08 ; B29C48/19 ; B29C48/20 ; B29C48/21 ; B29C48/86 ; B29C48/11 ; B29C48/255 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B29L7/00 ; B29L31/00

Abstract:
The present disclosure provides a die assembly for producing a microcapillary film. The die assembly includes a first die plate, a second die plate, a plurality of multi-jackbolt tensioners connecting the first die plate to the second die plate, a manifold, and a plurality of nozzles. The manifold is located between the pair of die plates and defines a plurality of film channels therebetween. The plurality of film channels converge into an elongate outlet, wherein a thermoplastic material is extrudable through the plurality of film channels and the elongate outlet to form a microcapillary film. The plurality of nozzles are located between the plurality of film channels. The plurality of nozzles are operatively connected to a source of channel fluid for emitting the channel fluid between layers of the microcapillary film, whereby a plurality of microcapillary channels are formed in the microcapillary film.
Public/Granted literature
- US20190001546A1 Die Assembly for Producing a Film Public/Granted day:2019-01-03
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