Invention Grant
- Patent Title: Process for producing surface-modified molded article, and process for producing composite using surface-modified molded article
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Application No.: US15508576Application Date: 2015-09-04
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Publication No.: US10730253B2Publication Date: 2020-08-04
- Inventor: Kazuya Yamamura , Yuji Ohkubo , Kento Ishihara , Masafumi Shibahara , Asahiro Nagatani , Koji Honda
- Applicant: OSAKA UNIVERSITY
- Applicant Address: JP Osaka
- Assignee: OSAKA UNIVERSITY
- Current Assignee: OSAKA UNIVERSITY
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3c3abed3
- International Application: PCT/JP2015/075272 WO 20150904
- International Announcement: WO2016/035894 WO 20160310
- Main IPC: B29C71/04
- IPC: B29C71/04 ; B32B27/30 ; C08J5/12 ; C08J7/00 ; C08J7/12 ; B29C37/00 ; B29C65/48 ; B29K27/18

Abstract:
An object of the present invention is to provide a process for producing a surface-modified molded article, whereby surface layer strength of a molded article can be enhanced, and a molded article containing an organic polymer compound with low adhesive property, such as a fluororesin, can be bonded to an adherend without the use of an adhesive, and whereby a treatment step or an apparatus in an atmospheric-pressure plasma treatment are not complicated, and to provide a process for producing a composite of the surface-modified molded article and an adherend. The present invention is a process for producing a surface-modified molded article wherein a surface of the molded article containing an organic polymer compound is subjected to an atmospheric pressure plasma treatment to introduce a peroxide radical with adjusting the surface temperature of the molded article to (melting point of the organic polymer compound −120° C. or higher.
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