A semiaromatic copolyamide resin and a polyamide molding composition consisting of the same are provided, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.