Invention Grant
- Patent Title: Polyimide precursor composition and use thereof
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Application No.: US15826871Application Date: 2017-11-30
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Publication No.: US10731004B2Publication Date: 2020-08-04
- Inventor: Chang-Hong Ho , Chung-Jen Wu , Meng-Yen Chou , Shun-Jen Chiang , Po-Yu Huang , Chung-Kai Cheng
- Applicant: ETERNAL MATERIALS CO., LTD.
- Applicant Address: TW Kaohsiung
- Assignee: ETERNAL MATERIALS CO., LTD.
- Current Assignee: ETERNAL MATERIALS CO., LTD.
- Current Assignee Address: TW Kaohsiung
- Agency: Ladas & Parry LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@785d839e
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08G18/10 ; C08G18/34 ; C08L79/08 ; B32B37/00 ; B32B38/10 ; B32B38/00 ; H05K1/03 ; C08G73/12 ; C09D179/08 ; H05K3/28 ; B32B38/16
Abstract:
The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P′, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.
Public/Granted literature
- US20180148541A1 POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF Public/Granted day:2018-05-31
Information query
