Invention Grant
- Patent Title: Heat conductive sheet and method of producing same, and heat dissipation device
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Application No.: US16078296Application Date: 2017-02-17
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Publication No.: US10731067B2Publication Date: 2020-08-04
- Inventor: Toyokazu Ito , Hiromi Kitagawa , Gen Kobayashi
- Applicant: ZEON CORPORATION
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: Kenja IP Law PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2957a241
- International Application: PCT/JP2017/006010 WO 20170217
- International Announcement: WO2017/145954 WO 20170831
- Main IPC: C08L27/12
- IPC: C08L27/12 ; C08K3/04 ; C08L27/14 ; C08L27/16 ; C08L27/18 ; C08L27/20 ; C09K5/14 ; C08J5/18 ; H05K7/20 ; H01L23/36 ; C01B32/152 ; C01B32/205 ; B32B27/08 ; B32B27/20 ; B32B37/18 ; B32B38/00 ; C08K7/06 ; F28F21/02 ; F28F21/06
Abstract:
Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having an Asker C hardness at 25° C. of 60 or more and a thermal resistance value under a pressure of 0.5 MPa of 0.20° C./W or less, a method of producing a heat conductive sheet, and a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator.
Public/Granted literature
- US20190048244A1 HEAT CONDUCTIVE SHEET AND METHOD OF PRODUCING SAME, AND HEAT DISSIPATION DEVICE Public/Granted day:2019-02-14
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