Invention Grant
- Patent Title: Dielectrostrictive sensors for shear stress measurement, process monitoring, and quality examination of viscoelastic materials
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Application No.: US15335744Application Date: 2016-10-27
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Publication No.: US10732055B2Publication Date: 2020-08-04
- Inventor: Yiyan Peng , Qian Wang
- Applicant: Northwestern University
- Applicant Address: US IL Evanston
- Assignee: Northwestern University
- Current Assignee: Northwestern University
- Current Assignee Address: US IL Evanston
- Agency: Benesch, Friedlander, Coplan & Aronoff LLP
- Main IPC: G01L1/14
- IPC: G01L1/14 ; G01N11/00 ; G01N11/14

Abstract:
Interdigitated dielectrostrictive sensors are employed to measure shear stress, and for obtaining strain-dielectric and stress-dielectric coefficients to monitor a process, and examine quality of dielectric materials, including but not limited to polymer, composite, grease, food, biofluids and etc. Each dielectrostrictive sensor includes at least two interdigitated sensors, each having at least two electrodes and a central axis. The central axes are disposed in a common plane and are oriented at different directions.
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