Invention Grant
- Patent Title: Cover structure and electronic device
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Application No.: US16000913Application Date: 2018-06-06
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Publication No.: US10732671B2Publication Date: 2020-08-04
- Inventor: Hsin Yeh , Chih-Wen Chiang , Jyh-Chyang Tzou
- Applicant: Hsin Yeh , Chih-Wen Chiang , Jyh-Chyang Tzou
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5a3f6ded
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
A cover structure is suitable for a portable device. The cover structure includes a body, a first flexible component, an accommodation component, a second flexible component and a connection component. The first flexible component is connected to the body, and the accommodation component is connected to the first flexible component. The accommodation component has an accommodation groove configured for accommodating an object. The second flexible component is connected to the accommodation component, and the first flexible component. The connection component is connected to the second flexible component. The connection component is connected to the body, and the connection component is configured for being connected to a portable device. An electronic device is also provided.
Public/Granted literature
- US20190278325A1 COVER STRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2019-09-12
Information query
