Invention Grant
- Patent Title: Conductive element, manufacturing method for same, input device, and electronic apparatus
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Application No.: US15759196Application Date: 2016-07-22
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Publication No.: US10732741B2Publication Date: 2020-08-04
- Inventor: Akira Sato , Takeshi Takahashi , Kazuya Hashimoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@ccb72a8
- International Application: PCT/JP2016/003420 WO 20160722
- International Announcement: WO2017/046987 WO 20170323
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H05K1/02 ; H05K3/12
Abstract:
A conductive element includes wiring having a flat portion at a top portion and including metal particles. An average value of a ratio of a width of the flat portion to a width of the wiring is 20% or more. An average value of arithmetic average roughness of the top portion is 1 μm or less.
Public/Granted literature
- US20180253164A1 CONDUCTIVE ELEMENT, MANUFACTURING METHOD FOR SAME, INPUT DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2018-09-06
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