CMOS anti-fuse cell
Abstract:
A CMOS anti-fuse cell is disclosed. In one aspect, an apparatus includes an N− well and an anti-fuse cell formed on the N− well. The anti-fuse cell includes a drain P+ diffusion deposited in the N− well, a source P+ diffusion deposited in the N− well, and an oxide layer deposited on the N− well and having an overlapping region that overlaps the drain P+ diffusion. A control gate is deposited on the oxide layer. A data bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the drain P+ diffusion exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the drain P+ diffusion. The leakage path is confined to occur in the overlapping region.
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