Invention Grant
- Patent Title: Impedance matching device
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Application No.: US16333381Application Date: 2017-09-25
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Publication No.: US10734196B2Publication Date: 2020-08-04
- Inventor: Tatsuya Morii , Masayuki Nakahama
- Applicant: DAIHEN Corporation
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: DAIHEN Corporation
- Current Assignee: DAIHEN Corporation
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Bozicevic, Field & Francis LLP
- Agent Bret E. Field
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7771470
- International Application: PCT/JP2017/034565 WO 20170925
- International Announcement: WO2018/062109 WO 20180405
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03H7/40 ; H05H1/46 ; H03H7/54 ; H03H7/38 ; H01G5/16

Abstract:
Provided is an impedance matching device for matching an impedance between a high-frequency power source and a load. The impedance matching device pertaining to the present invention is provided with: a matching circuit having variable capacitors, a capacitance of which is adjusted by an ON/OFF operation of a plurality of switches; a switch control unit for performing control for causing states of the switches of the variable capacitors to coincide with a target state in order to adjust the capacitance of the variable capacitors; and a switch state evaluation unit for evaluating whether a switch is in a state requiring suppression of a temperature increase. The switch control unit is configured so that when the switch state evaluation unit evaluates that a switch of the variable capacitors is in a state requiring suppression of a temperature increase, control is performed for suspending changing of a switch state of the switch for a set period and suppressing a temperature increase in the switch.
Public/Granted literature
- US20190214232A1 Impedance Matching Device Public/Granted day:2019-07-11
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