Methods, systems and apparatuses for an improved wafer and substrate carrier or container with improved modularity. More specifically, to a carrier or container with improved abilities which may provide high or low density carriers or containers with improved interchanging and compatibility, including for Tec-Cells, FOUPs, and other third party containers, carriers, modules, rings or any other systems, structures, apparatuses, or methods associated. The invention may provided an ability to interchange or be cross-compatible such as wherein Tec-Cell carriers, containers, rings or modules may be provided to be housed in a FOUP or other third party carrier or wherein substrates or wafers held in the Tec-Cell Carriers, rings, containers, or modules, and then held within the FOUP.