Invention Grant
- Patent Title: Top via back end of the line interconnect integration
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Application No.: US16194545Application Date: 2018-11-19
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Publication No.: US10734277B2Publication Date: 2020-08-04
- Inventor: Chih-Chao Yang , Lawrence A. Clevenger , Benjamin D. Briggs , Brent Anderson
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/768
- IPC: H01L21/768
Abstract:
Back end of line metallization structures and processes of fabricating the metallization structures generally include a top via integration scheme. The top via integration scheme integrally forms the via on top of trench. Thus, the via is fully aligned and can be of a desired critical dimension.
Public/Granted literature
- US20200161175A1 TOP VIA BACK END OF THE LINE INTERCONNECT INTEGRATION Public/Granted day:2020-05-21
Information query
IPC分类:
