An electrical device includes a substrate orientated parallel to a first plane and a first integrated circuit die disposed above the substrate. The first integrated circuit die includes pads that are electrically coupled to at least some of the pads at the top surface of the substrate. The electrical device has a packaging material disposed above the first integrated circuit die. The electrical device includes one or more test pads that are orientated parallel to the first plane and disposed above the first integrated circuit die in the vertical direction. The one or more test pads are electrically coupled to the first integrated circuit die and encased within the packaging material such that the one or more test pads are not exposed external to the electrical device.