- Patent Title: Method and apparatus of operating a compressible thermal interface
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Application No.: US16247476Application Date: 2019-01-14
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Publication No.: US10734302B2Publication Date: 2020-08-04
- Inventor: Mysore Purushotham Divakar , Juergen Mueller , Michael Mo
- Applicant: KULR TECHNOLOGY CORPORATION
- Applicant Address: US CA Campbell
- Assignee: KULR TECHNOLOGY CORPORATION
- Current Assignee: KULR TECHNOLOGY CORPORATION
- Current Assignee Address: US CA Campbell
- Agency: Venture Pacific Law, PC
- Main IPC: H01L23/373
- IPC: H01L23/373 ; F28F21/02 ; H01L23/552 ; H01L23/42

Abstract:
A thermal electrical (TE) interface comprises a primary fiber thermal interface (FTI) having a first side configured to contact a heatsink, and a second side. The primary fiber thermal interface has a thickness ranging from 0.3 mm to 4 mm. A secondary fiber thermal interface (FTI) has a first side configured to contact the second side of the primary FTI, a second side configured to contact circuit components to dissipate heat from the circuit components through the first side of the primary FTI. The secondary fiber thermal interface has a thickness equal to or greater than the primary FTI.
Public/Granted literature
- US20190221495A1 Method and Apparatus of Operating a Compressible Thermal Interface Public/Granted day:2019-07-18
Information query
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