- Patent Title: Integration of a passive component in an integrated circuit package
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Application No.: US15951021Application Date: 2018-04-11
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Publication No.: US10734313B2Publication Date: 2020-08-04
- Inventor: Jeffrey Morroni , Rajeev Dinkar Joshi , Sreenivasan K. Koduri , Sujan Kundapur Manohar , Yogesh K. Ramadass , Anindya Poddar
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/065 ; H01L23/31 ; H01L23/29 ; H01L23/498 ; H01L25/16 ; H01L23/50
Abstract:
A semiconductor package includes a leadframe and a semiconductor die attached to the leadframe by way of solder posts. In a stacked arrangement, the package also includes a passive component disposed between the leadframe and the semiconductor die and electrically connected to the semiconductor die through the leadframe.
Public/Granted literature
- US20180301404A1 INTEGRATION OF A PASSIVE COMPONENT IN AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2018-10-18
Information query
IPC分类:
