- Patent Title: Method and system for packing optimization of semiconductor devices
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Application No.: US15968360Application Date: 2018-05-01
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Publication No.: US10734343B2Publication Date: 2020-08-04
- Inventor: Glenn Rinne , Daniel Richter
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.
Public/Granted literature
- US20180247909A1 Method and System for Packing Optimization of Semiconductor Devices Public/Granted day:2018-08-30
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