Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16250056Application Date: 2019-01-17
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Publication No.: US10734375B2Publication Date: 2020-08-04
- Inventor: Kenji Kono
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6d28dd6a
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/40 ; H01L29/06 ; H01L29/08 ; H01L29/78 ; H01L29/739 ; H01L29/10 ; H01L29/423 ; H01L23/00 ; H03K17/12 ; H03K17/567

Abstract:
A semiconductor device includes a plurality of switching devices and a semiconductor substrate. The switching devices are connected in parallel to be driven. The switching devices are at the semiconductor substrate. Each of the switching devices, in a plan view of the semiconductor substrate, includes: a cell region as an IGBT that is provided with an active trench gate to be applied with a gate voltage; a periphery region as a contour of the switching device; and a non-cell region configured to isolate the cell region from the periphery region and arranged with a pad to provide an electrical connection to the cell region. The non-cell region is also provided with an active trench gate that is at a position without overlapping the pad.
Public/Granted literature
- US20190148364A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-05-16
Information query
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